The new IBM Distributed Power Interconnect (DPI) is a cost-effective solution for xSeries customers looking for an efficient power distribution product for the rack environment. This high-density PDU is ideal for extending and enhancing the levels of availability while supporting even the most power-demanding servers. While primarily designed for xSeries servers, it also supports mid-range and high-end server products. It is a rack-based product that can: speed installation; save money; decrease amount of cabling required; increase solution management.
The new DPI PDU replaces the current PDUs. The new models also deploy the same modular approach to power distribution as current PDUs. These new models contain connector linking components rather than country-specific hard-wired line cords. They are built on the ideas of the IBM Interconnect Rack Architecture. They are usable worldwide and are far advanced from the competition in setup, ease of installation, and scalability.