B-719 is constructed with a static dissipative adhesive. This product has adhesive surface resistivity values in the recommended range for dissipative ESD packaging materials.
B-719 has a low profile (1 mil) film, allowing for easier use in processes which demand thin and/or lighter weight label materials.
B-719 matte topcoat is designed to resist solder balls from sticking to the label after exposure to molten wave solder.